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Boya Micro

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Zhuhai BOYA Technology Co., Ltd. was established in 2014 in Zhuhai, Guangdong.

As a fabless IC design company that focuses on researching, developing, promoting, and selling non-volatile memory. Using ETOX and SONOS Flash memory design technology for different applications, BOYA is able to develop various SPI NOR Flash products covering densities from 512Kb to 2Gb and Parallel NOR Flash 1Gb-2Gb. In 2023, BOYA is actively expanding its product line into NAND FLASH and also provides customized development services for customers.

Since its inception, BOYA has continuously invested in research and development, emphasized innovation, and promoted technological breakthroughs to offer customers high-quality products and services. Additionally, We focus on marketing, customer relationships, management innovation, and cultural adaptability, among other aspects, to enhance core competitiveness from multiple perspectives and achieve sustainable development.


Our core philosophy is "people-oriented, moral, honest management, development and innovation",

Strive to create a corporate culture characterized by technological and management innovation, and strive for comprehensive management and balanced management,

Improve work efficiency and service quality, so as to achieve the harmony between supply and demand,

And to drive the sustainable development of enterprises with clearer and more effective goals, to achieve the maximum win-win between enterprises and employees, enterprises and customers.

Boya slogan: open a new face, create a future.

Boya's vision: to become a leading chip supplier in China and create a core world for the storage industry.

Boya values: professional, standard, win-win, development.


▌ Product introduction

SPI NOR Flash

Developed and designed by BOYA Technology, our SPI NOR Flash is a mainstream memory technology with high reliability, endurance, and exceptional data retention. NOR Flash is widely used across multiple products including Mobile Phones, Computer Motherboards and Peripherals, Digital Cameras, TWS Earbuds, Gaming Consoles, Networking and 5G Infrastructure, Communication Modules incorporating WiFI and Bluetooth, IoT and Smart Home devices.   


Flash memory with SPI interface conforming to the JEDEC standard;
Process Technology: 65nm / 55nm / 50nm;
Memory capacity: 512kb ~ 1Gb;
Single, Double and Quad SPI; bandwidth: up to 432mbps;
Data Retention: more than 20 years;
Endurance: 100,000 times;
Working temperature range: - 40 ℃ ~ 125 ℃


Parallel NOR Flash

Developed and designed by BOYA Technology, our Parallel NOR Flash is a mainstream memory technology with high reliability, endurance, and exceptional data retention. NOR Flash is widely used across multiple products including Mobile Phones, Computer Motherboards and Peripherals, Digital Cameras, TWS Earbuds, Gaming Consoles, Networking and 5G Infrastructure, Communication Modules incorporating WiFI and Bluetooth, IoT and Smart Home devices.   

Flash memory with 8 and 16bit data bus width conforming to JEDEC Standard;
Process Technology:   50nm;
Memory capacity: 1Gb and 2Gb;
High Performance:
Fast access time: 130ns
Page access time: 25ns
Data Retention: more than 20 years;
Endurance: 100,000 times;
Working temperature range: - 40 ℃ ~ 125 ℃



KGD

BOYA Technology offers Known Good Die (KGD) products in addition to standard packaged NOR Flash memory devices. KGD memory is the preferred option for chipset vendors that wish to include non-volatile memory in System-in-Package (SIP) or Multi-Chip-Modules (MCM’s) to reduce device footprint, increase security and simplify system design. Our KGD memory products have the same superior quality and performance as our packaged parts, with all memory die pre-tested and verified. KGD offers a compact and reliable solution for modules used in mobile and IoT devices, enabling manufacturers to improve device performance, reduce the risk of failure and optimize space utilization.

All SPI NOR products are offered with a KGD option.
KGD products are delivered in wafer form without dicing.
Dedicated technical staff to work with KGD customers.
Please do not hesitate to contact us if you have any KGD related requirements.


EEPROM

BOYA Technologies IIC EEPROM products are compatible with the mainstream devices available in the industry. Our faster data write speed sets the standard for others to surpass, available in a variety of miniaturized package types, and widely used across multiple markets including consumer, industrial and communications.


Capacity 64kbit to 128kbit, IIC interface, working voltage: 1.65v ~ 2.2V, IIC frequency: 1MHz
Reliability: data retention time is 10 years, erasure life is 10000 times, read life is infinite times
Miniaturization package: sop8, tssop8, WLCSP
Security features: support 64BYTE uid and 64BYTE OTP security sector, flexible partition protection support
Write speed: 1-4 byte write 70us, page write 0.5ms
Advanced technology, smaller area of single storage unit




珠海博雅科技股份有限公司,是一家总部位于中国珠海的芯片设计公司,公司致力于存储类芯片的设计研发,研发部门分布于珠海,上海等地,同时在深圳,上海,北京,珠海等设置销售办公室,能够本地化服务广大客户,分销代理网络覆盖中国大陆及港台地区。


公司核心海归博士团队已入选珠海市创新创业团队,曾在国际著名半导体公司工作多年,掌握存储器及人工智能芯片研发设计核心技术,拥有多项半导体存储器技术专利。

公司专注于储存器产品,SPI NOR FLASH自2014年以来批量应用于客户,迄今客户使用,出货量累计超10亿颗,品质稳定可靠,客户满意度优良。 产品广泛应用于各类嵌入式系统,包括消费电子,数码产品,电脑相关,网络通信等,性能参数完全兼容全球同类知名品牌SPANSION,WINBOND,MXIC,GD等,性价比优势明显。

珠海博雅科技是国家集成电路产业联盟的重要成员,是广东省高端集成电路闪型存储器工程技术研究中心,高新技术企业,通过ISO9001认证,和上海华力,中芯国际等产业链上下游著名公司和机构深度合作,业绩稳步发展,正在大步实现我们的企业愿景:成为国内领先,世界前列的高科技企业。


▌ 3.3V

Part No.DensityFrequency
(MHz)
FeaturePackageTemperatureStatus
BY25D05AS512Kb108 (x1, x2)WP#, Unique IDSOP8 150mil,
TSSOP8 173mil,
USON8 (2*3mm),
-40℃ to +85℃MP
BY25D10AS1Mb108 (x1, x2)WP#,   Unique IDSOP8 150mil,
TSSOP8 173mil,
USON8 (2*3mm),
-40℃ to +85℃MP
BY25D20AS2Mb108 (x1, x2)WP#,   Unique IDSOP8 150mil,
TSSOP8 173mil,
USON8 (2*3mm),
-40℃ to +85℃MP
BY25D40AS4Mb108 (x1, x2)WP#,   Unique IDSOP8 150mil,
SOP8 208mil,
TSSOP8 173mil,
USON8 (2*3mm),
-40℃ to +85℃MP
BY25D40ES4Mb108 (x1, x2)WP#,   Unique IDSOP8 150mil,
SOP8 208mil,
TSSOP8 173mil,
-40℃ to +85℃UP
BY25D80AS8Mb108 (x1, x2)WP#,   Unique IDSOP8 150mil,
SOP8 208mil,
TSSOP8 173mil,
USON8 (2*3-0.5mm),
USON8 (3*3*0.75-0.65mm),
-40℃ to +85℃
-40℃ to +105℃
MP
BY25Q80BS8Mb108 (x1, x2, x4)WP#,   Unique ID, QPI, XIP,
   Secured OTP, S/W RESET,
Suspend
SOP8 150mil,
SOP8 208mil,
DFN (2*3*0.5-0.5mm)
-40℃ to +85℃
-40℃to +105℃
MP
BY25Q80ES8Mb108 (x1, x2, x4)WP#,   Unique ID,   XIP,
   Secured OTP, S/W RESET, Suspend
SOP8 150mil,
WSON (5*6mm),
WSON (6*8mm),
-40℃ to +85℃UP
BY25D16AS16Mb108 (x1, x2)WP#,   Unique IDSOP8 150mil,
SOP8 208mil,
USON8 (2*3-0.5mm),
USON8 (2*3-0.55mm),
USON (3*4mm),
WSON (5*6mm),
-40℃ to +85℃
-40℃to +105℃
MP
BY25Q16BS16Mb108 (x1, x2, x4)WP#,   Unique ID, QPI, XIP,
   Secured OTP, S/W RESET, Suspend
SOP8 208mil,
WSON (5*6mm),
WSON (6*8mm),
-40℃ to +85℃
-40℃to +105℃
MP
BY25Q16ES16Mb108 (x1, x2, x4)WP#,   Unique ID, QPI, XIP,
   Secured OTP, S/W & H/W RESET, Suspend
SOP8 208mil,
WSON (5*6mm),
DFN (2*3mm),
-40℃ to +85℃
-40℃to +105℃
UP
BY25Q32BS32Mb108 (x1, x2, x4)WP#,   Unique ID,
   Secured OTP, S/W RESET, Suspend
SOP8 150mil,
SOP8 208mil,
USON (3*4mm),
WSON (5*6mm),
-40℃ to +85℃
-40℃to +105℃
MP
BY25Q32CS32Mb108 (x1, x2, x4)WP#,   Unique ID, QPI,
   Secured OTP, S/W RESET, Suspend
SOP8 150mil,
SOP8 208mil,
USON8 (2*3-0.75mm),
USON (3*4mm),
WSON (5*6mm),
-40℃ to +85℃
-40℃to +105℃
MP
BY25Q32ES32Mb120 (x1, x2, x4)WP#,   Unique ID, XIP,
   Secured OTP, S/W & H/W RESET, Suspend
SOP8 150mil,
SOP8 208mil,
USON (3*4mm),
WSON (6*5mm),
-40℃ to +85℃UP
BY25Q64AS64Mb108 (x1, x2, x4)WP#,   Unique ID,
   Secured OTP, S/W RESET, Suspend
SOP8 150mil,
SOP8 208mil,
USON (3*4mm),
WSON (5*6mm),
-40℃ to +85℃
-40℃to +105℃
MP
BY25Q64ES64Mb120 (x1, x2, x4)WP#,   Unique ID, XIP,
   Secured OTP, S/W & H/W RESET, Suspend
SOP8 150mil,
SOP8 208mil,
USON (3*4mm),
WSON (5*6mm),
-40℃ to +85℃MP
BY25Q128AS128Mb108 (x1, x2, x4)WP#,   Unique ID,
   Secured OTP, S/W RESET, Suspend
SOP8 208mil,
SOP16,
WSON (5*6mm),
-40℃ to +85℃
-40℃to +105℃
MP
BY25Q128ES128Mb120 (x1, x2, x4)WP#,   Unique ID, XIP,
   Secured OTP, S/W & H/W RESET, Suspend
SOP8 208mil,
WSON (5*6mm),
-40℃ to +85℃MP
BY25Q128FS128Mb120 (x1, x2, x4)WP#,   Unique ID, XIP,
   Secured OTP, S/W & H/W RESET, Suspend
SOP8 208mil,
WSON (5*6mm),
-40℃ to +85℃MP
BY25Q256ES256Mb100 (x1, x2, x4)
50 (x4, DTR)
WP#,   Unique ID, QPI, XIP,
   Secured OTP, S/W & H/W RESET, Suspend, 3/4 Byte Add Mode
SOP8 208mil,
SOP16,
WSON (5*6mm),
WSON (6*8mm),
-40℃ to +85℃MP
BY25Q256FS256Mb100 (x1, x2, x4)
50 (x4, DTR)
WP#,   Unique ID, QPI, XIP,
   Secured OTP, S/W & H/W RESET, Suspend, 3/4 Byte Add Mode
SOP8 208mil,
SOP16,
WSON (5*6mm),
WSON (6*8mm),
-40℃ to +85℃MP
BY25QM512FS512Mb100 (x1, x2, x4)
50 (x4, DTR)
WP#,   Unique ID, QPI, XIP,
   Secured OTP, S/W & H/W RESET, Suspend, 3/4 Byte Add Mode
SOP16,
WSON (6*8mm),
DFN (2*3*0.5-0.5mm),
TFBGA24 (6*8mm),
-40℃ to +85℃MP
BY25QM1G1FS1Gb108 (x1, x2, x4)
54 (x4, DTR)
WP#,   Unique ID, XIP,
   Secured OTP, S/W RESET, Suspend, 3/4 Byte Add Mode
WSON (6*8mm),
DFN (2*3*0.5-0.5mm),
TFBGA24 (6*8mm),
-40℃ to +85℃MP
BY25QM1GFS1Gb100 (x1, x2, x4)
50 (x4, DTR)
WP#,   Unique ID, QPI, XIP,
   Secured OTP, S/W & H/W RESET, Suspend, 3/4 Byte Add Mode
SOP16,
TFBGA24 (6*8mm),
-40℃ to +85℃MP

▌ 1.8V

Part No.DensityFrequency
   (MHz)
FeaturePackageTemperatureStatus
BY25Q10AL1Mb108 (x1, x2, x4)WP#,   Unique ID,
   Secured OTP, S/W RESET, Suspend
SOP8 150mil,
SOP8 208mil,
TSSOP8 173mil,
USON8 (2*3-0.5mm),
USON8 (2*3-0.55mm),
-40℃ to +85℃MP
BY25Q20AL2Mb108 (x1, x2, x4)WP#,   Unique ID,
   Secured OTP, S/W RESET, Suspend
SOP8 150mil,
SOP8 208mil,
TSSOP8 173mil,
USON8 (2*3-0.5mm),
USON8 (2*3-0.55mm),
-40℃ to +85℃UP
BY25Q20BL2Mb108 (x1, x2, x4)WP#,   Unique ID,
   Secured OTP, S/W & H/W RESET, Suspend
SOP8 150mil,
SOP8 208mil,
TSSOP8 173mil,
USON8 (2*3mm),
USON6 (1.2*1.2*0.4mm),
USON6 (1.2*1.2*0.5mm),
USON8 (1.5*1.5*0.4mm),
USON8 (1.5*1.5*0.45mm),
-40℃ to +85℃MP
BY25Q40AL4Mb108 (x1, x2, x4)WP#,   Unique ID,
   Secured OTP, S/W RESET, Suspend
SOP8 150mil,
SOP8 208mil,
TSSOP8 173mil,
USON8 (2*3-0.5mm),
USON8 (2*3-0.55mm),
-40℃ to +85℃MP
BY25Q40BL4Mb108 (x1, x2, x4)WP#,   Unique ID,
   Secured OTP, S/W RESET, Suspend
SOP8 150mil,
SOP8 208mil,
TSSOP8 173mil,
USON8 (2*3mm),
USON8 (3*3mm),
WSON (6*5mm),
-40℃ to +85℃MP
BY25Q40GL4Mb108 (x1, x2, x4)WP#,   Unique ID,
   Secured OTP, S/W RESET, Suspend
SOP8 150mil,
SOP8 208mil,
TSSOP8 173mil,
USON8 (2*3mm),
USON8 (3*3mm),
WSON (5*6mm),
-40℃ to +85℃MP
BY25Q16BL16Mb108 (x1, x2, x4)WP#,   Unique ID,
   Secured OTP, S/W & H/W RESET, Suspend
SOP8 150mil,
SOP8 208mil,
TSSOP8 173mil,
USON8 (2*3mm),
-40℃ to +85℃MP
BY25Q32AL32Mb104 (x1, x2, x4)WP#,   Unique ID, QPI
   Secured OTP, S/W & H/W RESET, Suspend
SOP8 208mil,
USON8 (3*3mm),
USON (3*4mm),
VSOP8,
WSON (5*6mm),
-40℃ to +85℃MP
BY25Q32EL32Mb108 (x1, x2, x4)WP#,   Unique ID, QPI, XIP,
   Secured OTP, S/W & H/W RESET, Suspend
SOP8 208mil,
WSON (5*6mm),
WSON (6*8mm),
SOP16
-40℃ to +85℃UP
BY25Q64AL64Mb108 (x1, x2, x4)WP#,   Unique ID, QPI,
   Secured OTP, S/W & H/W RESET, Suspend
SOP8 208mil,
WSON (5*6mm),
-40℃ to +85℃MP
BY25Q64EL64Mb108 (x1, x2, x4)WP#,   Unique ID, QPI, XIP,
   Secured OTP, S/W & H/W RESET, Suspend
SOP8 208mil,
SOP16,
WSON (5*6mm),
-40℃ to +85℃UP
BY25Q128EL128Mb108 (x1, x2, x4)WP#,   Unique ID, QPI, XIP,
   Secured OTP, S/W & H/W RESET, Suspend
SOP8 150mil,
SOP16,
WSON (5*6mm),
WSON (6*8mm),
-40℃ to +85℃UP

▌ 1.65~3.6V

Part No.DensityFrequency
   (MHz)
FeaturePackageTemperatureStatus
BY25Q05AW512Kb85 (x1, x2, x4)WP#,   Unique ID,
   Secured OTP, S/W RESET, Suspend
VSOP 208mil,
WSON (5*6mm),
-40℃ to +85℃MP
BY25Q10AW1Mb85 (x1, x2, x4)WP#,   Unique ID,
   Secured OTP, S/W RESET, Suspend
VSOP 208mil,
WSON (5*6mm),
-40℃ to +85℃MP
BY25Q20AW2Mb85 (x1, x2, x4)WP#,   Unique ID,
   Secured OTP, S/W & H/W RESET, Suspend
SOP8 150mil,
SOP8 208mil,
TSSOP8 173mil,
USON8 (2*3mm),
-40℃ to +85℃MP
BY25Q40AW4Mb85 (x1, x2, x4)WP#,   Unique ID,
   Secured OTP, S/W RESET, Suspend
SOP8 150mil,
SOP8 208mil,
TSSOP8 173mil,
USON8 (2*3mm),
USON8 (3*3mm),
WSON (5*6mm),
-40℃ to +85℃MP
BY25Q40GW4Mb85 (x1, x2, x4)WP#,   Unique ID,
   Secured OTP, S/W RESET, Suspend
SOP8 150mil,
SOP8 208mil,
TSSOP8 173mil,
USON8 (3*3mm),
WSON (5*6mm),
USON8 (2*3-0.5mm),
USON8 (2*3-0.55mm),
-40℃ to +85℃MP
BY25Q80AW8Mb100 (x1, x2, x4)WP#,   Unique ID,
   Secured OTP, S/W RESET, Suspend
SOP8 150mil,
SOP8 208mil,
TSSOP8 173mil,
USON8 (1.5*1.5*0.45mm),
USON8 (2*3-0.45mm),
USON8 (2*3-0.55mm),
-40℃ to +85℃MP
BY25Q16AW16Mb100 (x1, x2, x4)WP#,   Unique ID,
   Secured OTP, S/W & H/W RESET, Suspend
SOP8 150mil,
SOP8 208mil,
TSSOP8 173mil,
USON8 (2*3-0.45mm),
USON8 (2*3-0.5mm),
USON8 (2*3-0.55mm),
-40℃ to +85℃MP


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