请登录注册微信登录
收藏本站我的资料座机：0755-84866816电话：13924645577发送邮件线上留言全球芯商城
新闻详情

SAMSUNG: UFS 2.1 parts

103
发表时间：2024-03-19 13:59作者：glochip.com来源：GlobalizeX.COM网址：https://www.glochip.com/news/
Version
Capacity
Voltage
Interface
Package Size
Temperature
Product Status
KLUCG4J1ZD-C0CQ
UFS 2.1
64 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 105 °C
Mass Production
KLUBG4G1ZF-C0CP
UFS 2.1
32 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 95 °C
Mass Production
KLUBG4G1ZF-C0CQ
UFS 2.1
32 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 105 °C
Mass Production
KLUCG4J1ZD-C0CP
UFS 2.1
64 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 95 °C
Mass Production
KLUDG8J1ZD-C0CQ
UFS 2.1
128 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 105 °C
Mass Production
KLUDG8J1ZD-C0CP
UFS 2.1
128 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 95 °C
Mass Production
KLUEGAJ1ZD-C0CP
UFS 2.1
256 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.72 mm
-40 ~ 95 °C
Mass Production
KLUEGAJ1ZD-C0CQ
UFS 2.1
256 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.72 mm
-40 ~ 105 °C
Mass Production
KLUBG4G1ZF-B0CP
UFS 2.1
32 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 85 °C
Mass Production
KLUBG4G1ZF-B0CQ
UFS 2.1
32 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 105 °C
Mass Production
KLUCG2U1YB-B0CP
UFS 2.1
64 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 85 °C
Mass Production
KLUCG2U1YB-B0CQ
UFS 2.1
64 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 105 °C
Mass Production
KLUCG4J1ED-B0C1
UFS 2.1
64 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.0 mm
-25 ~ 85 °C
Mass Production
KLUCG4J1ZD-B0CP
UFS 2.1
64 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 85 °C
Mass Production
KLUCG4J1ZD-B0CQ
UFS 2.1
64 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 105 °C
Mass Production
KLUDG4U1FB-B0C1
UFS 2.1
128 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.0 mm
-25 ~ 85 °C
Mass Production
KLUDG4U1YB-B0CP
UFS 2.1
128 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 85 °C
Mass Production
KLUDG4U1YB-B0CQ
UFS 2.1
128 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 105 °C
Mass Production
KLUDG8J1ZD-B0CP
UFS 2.1
128 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 85 °C
Mass Production
KLUDG8J1ZD-B0CQ
UFS 2.1
128 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 105 °C
Mass Production
KLUEG8U1YB-B0CP
UFS 2.1
256 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 85 °C
Mass Production
KLUEG8U1YB-B0CQ
UFS 2.1
256 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 105 °C
Mass Production
KLUEGAJ1ZD-B0CP
UFS 2.1
256 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.72 mm
-40 ~ 85 °C
Mass Production
KLUEGAJ1ZD-B0CQ
UFS 2.1
256 GB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.72 mm
-40 ~ 105 °C
Mass Production
KLUGGAR1FA-B2C1
UFS 2.1
1 TB
1.8 / 3.3 V
G3 2Lane
11.5 x 13 x 1.4 mm
-25 ~ 85 °C
Mass Production


Note：<全球芯科技 | Glochip.com> http://chip.co.at/h-nd-552.html
分享到：
深圳市全球芯科技有限公司
Memory chips and devices
地址：深圳市福田区中国凤凰大厦1栋2108A 电话：0755-84828852 0577-84866816 邮箱：kevin@glochip.com
网址：www.glochip.com
热线：13924645577  13924649321
友情链接
首页                                  服务产品                                    新闻资讯                                公司介绍                                     联系我们                 全球芯商城
电话:  0755-84866816  13924645577
电话: 0755-84828852  13924649321
邮箱:  kevin@glochip.com
网址:  www.glochip.com
地址：深圳市福田区中国凤凰大厦1栋2108A
邮编：518038
eMail򠀧
Samsung Micron SKhynix Kingston Sandisk  Kioxia Nanya Winbond MXIC ESMT Longsys Biwin HosgingGlobal  BoyaMicro  Piecemakers Rayson  Skyhigh  Netsol

SRAM MRAM SDRAM DDR1 DDR2 DDR3 DDR4  DDR5 LPDDR3 LPDDR4 LPDDR4X  LPDDR5 LPDDR5X NAND NOR eMMC UFS eMCP uMCP SSD Module
分享